Effect Of Modification Of Hexagonal Boron Nitride Powder On PI Film Of Thermally Conductive Material
Aug 18, 2023
The modification of hexagonal boron nitride (h-BN) powder has a positive impact on the performance of thermal conductive materials such as PI (Polyimide) film. The modified h-BN powder can significantly improve the thermal conductivity of the PI film, making it more suitable for electronic devices that require efficient heat dissipation.
In addition, the modified h-BN powder can also enhance the mechanical properties of the PI film, such as its tensile strength and Young's modulus. This makes the film more durable and resistant to deformation, which is an important characteristic for applications in the electronics industry.
Furthermore, the modification of h-BN powder can also improve the compatibility of the PI film with other materials. This can lead to better adhesion between films and substrates, reducing the risk of delamination and increasing the reliability of the final product.
In summary, the modification of h-BN powder has a positive impact on the properties of PI films used in thermal conductive applications. It improves thermal conductivity, mechanical properties, and compatibility with other materials, providing a significant advantage for the electronics industry.
