Wide application of hexagonal boron nitride - chip cooling material

As electronic components and systems become smaller and faster, heat treatment and reliability become key issues affecting their longevity. The thermal management of local hot spot with high heat flow is the key of high power electronic devices.

Although graphene has a very high thermal conductivity (5300W/(m·K)), it was found in the experiment that the thickness of the silicon dioxide insulation layer on the chip surface would affect the heat dissipation effect of graphene. If the silicon dioxide layer is too thick, it will hinder the effective conduction of hot spot heat to the graphene layer; if the silicon dioxide layer is too thin, it is easy to make the metal circuit contact with the graphene layer and cause short circuit. Hexagonal boron nitride, as a material of both insulation and high thermal conductivity, will become the key material to improve the heat dissipation capacity of chips.